RO3203 PCB 4-Layer 0.6mm Thick High-Frequency Ceramic-Filled Laminates for Automotive and Wireless Systems

1.Introduction to RO3203 High Frequency Circuit Materials

RO3203 High Frequency Circuit Materials are advanced ceramic-filled laminates reinforced with woven fiberglass. Engineered for superior electrical performance and mechanical stability, these materials offer competitive pricing. Designed as an enhancement of the RO3000 Series, RO3203 stands out with its improved mechanical stability. It features a dielectric constant of 3.02 and a dissipation factor of 0.0016, enabling effective performance at frequencies exceeding 40 GHz.

2.Features

Material Composition: Rogers RO3203 ceramic-filled PTFE composites
Dielectric Constant: 3.02 ± 0.04 at 10 GHz/23°C
Dissipation Factor: 0.0016 at 10 GHz/23°C
Thermal Decomposition Temperature: > 500°C
Thermal Conductivity: 0.87 W/mK
Coefficient of Thermal Expansion (from -55 to 288°C):
X-axis: 13 ppm/°C
Y-axis: 13 ppm/°C
Z-axis: 58 ppm/°C
Environmental Compliance: Lead-free process compatible, 94V-0 flammability rating

3.Benefits

Woven Glass Reinforcement: Enhances rigidity for easier handling.
Uniform Performance: Ideal for complex multi-layer high frequency structures.
Low Dielectric Loss: Optimized for applications exceeding 20 GHz.
Low In-Plane Expansion Coefficient: Matches copper, suitable for epoxy multi-layer board hybrid designs and reliable surface-mounted assemblies.
Excellent Dimensional Stability: High production yields.
Cost-Effective: Economically priced for volume manufacturing.
Smooth Surface: Facilitates finer line etching tolerances.

4.PCB Stackup: 4-Layer Rigid PCB

Copper Layer 1: 35 µm
Rogers RO3203 Substrate: 10 mil (0.254 mm)
Copper Layer 2: 35 µm
Prepreg FR-28
Copper Layer 1: 35 µm
Rogers RO3203 Substrate: 10 mil (0.254 mm)
Copper Layer 2: 35 µm

5.PCB Construction Details

Board Dimensions: 49.6 mm x 25.2 mm (1 piece)
Minimum Trace/Space: 4/6 mils
Minimum Hole Size: 0.3 mm
Blind Vias: L1-L2
Finished Board Thickness: 0.6 mm
Finished Copper Weight: 1 oz (1.4 mils) for outer layers
Via Plating Thickness: 20 µm
Surface Finish: Immersion Gold
Top Silkscreen: None
Bottom Silkscreen: None
Top Solder Mask: None
Bottom Solder Mask: None
Electrical Testing: 100% electrical test prior to shipment

6.PCB Statistics

Components: 10
Total Pads: 20
Thru Hole Pads: 10
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 15
Nets: 4

7.Artwork and Standards

Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

8. Typical Applications

Automotive collision avoidance systems
Automotive global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure